White Paper
Short summary:
but overclocking can require the additional cooling pro. vided by the H. 2. C technology. ... overclocking risks from heat buildup. In Dell perfor ...
Long summary:
White PaperPage 11January 2007DELL H2C TECHNOLOGY:HYBRID COOLING FOR OVERCLOCKED CPUSWayne Caswell Product Marketing Senior ConsultantDell recently introduced a hybrid cooling system in new highend Dell™ XPS™ 710 gaming systems.H2Ceramic (H2C™) cooling is a patentpending technology that supports CPU overclocking.1It uses a unique twostage cooling process that combines a highperformance liquidtoair heat exchanger thermoelectric fluid chiller and control circuitry to optimize CPU cooling with minimal power. H2Ceramic cooling is designed for PC enthusiasts and highend gamers who overclock their CPUs to get top performance. These systems need extra cooling to help avoid failures caused by overheating. H2C extends CPU cooling capacity beyond what is possible with heat sinks and forcedair convection or more conventional liquid cooling systems. H2C uses thermal sensors electronic controls and active management of fan speeds and thermoelectric cooling (TEC) voltage to keep CPU temperature slightly above ambient room temperature which prevents the formation of humidity condensation or frost. TEC modules at the center of the heat exchanger rely on the same Peltier effect2that is used to counter the effect of direct sunlight on only one side of a satellite or spacecraft. The Peltier effect dissipates the heat over the cold shaded side and from there into deep space.The Need for Advanced CPU Cooling CPU cooling has become more of an issue in recent years as the industry moved to higherfrequency processors. The Intel 8088 processor used in the original IBM personal computer ran at only 4.77 MHz and did not require a heat sink. However CPU clock rates have risen sharply since then producing much more heat and most systems now ship with large heat sinks and fans to cool the processor. Dualcore and multicore processor architectures help to moderate thermal issues by increasing system performance without increasing frequency. Future performance gains will rely less ...
Source: www.dell.com
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